Semiconductor Application-Shenzhen Micsig Technology Co., Ltd.

Semiconductor Application

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Application Scenarios

With the continuous advancement of semiconductor manufacturing processes, the operating voltage of chips keeps decreasing while signal speed rises steadily. The electrical characteristics of high-speed digital circuits and power devices have become increasingly complex, imposing stricter requirements on the bandwidth, precision and stability of test and measurement equipment. In key stages including chip design verification, power device characteristic analysis, R&D of third-generation semiconductors such as SiC and GaN, and advanced packaging testing, engineers need to reliably capture and accurately analyze high-speed transient signals, low-amplitude weak signals and high-frequency noise.

Core Challenges

For high-frequency and high-speed signal measurement, signal integrity is vulnerable to transmission loss, reflection and crosstalk, making it hard to secure reliable measurement results. Weak signals feature tiny amplitude and are easily submerged by system noise and environmental interference. Under complex operating conditions with high common-mode voltage and strong electromagnetic interference, common-mode rejection becomes extremely difficult, resulting in compromised measurement accuracy and stability.

Solution

Micsig offers a combination of high-bandwidth, high-precision oscilloscopes and SigOFIT optical isolated probes to accurately restore tiny signals. Equipped with high CMRR performance, the system delivers stable measurements even under high common-mode voltage conditions. It supports high-speed dynamic analysis to facilitate chip performance verification.